Intel 5CGXFC4B6F23C6N

表面安装

YES

终端数量

484

Manufacturer Part Number

5CGXFC4B6F23C6N

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

BGA,

Risk Rank

5.59

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

1.13 V

Supply Voltage-Min

1.07 V

Supply Voltage-Nom

1.1 V

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B484

温度等级

OTHER

座位高度-最大

2 mm

可编程逻辑类型

现场可编程门阵列

长度

23 mm

宽度

23 mm