Intel AC82X58/SLGBT

表面安装

YES

终端数量

1295

Manufacturer Part Number

AC82X58/SLGBT

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Package Description

BGA, BGA1295,36X36,40

Risk Rank

5.84

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA1295,36X36,40

Package Shape

SQUARE

Package Style

网格排列

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B1295

资历状况

不合格