Intel BD27C256

表面安装

NO

终端数量

28

Manufacturer Part Number

BD27C256

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Package Description

DIP, DIP28,.6

Risk Rank

5.92

Access Time-Max

250 ns

Number of Words

32768 words

Number of Words Code

32000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP28,.6

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T28

电源

5 V

温度等级

AUTOMOTIVE

组织结构

32KX8

输出特性

3-STATE

内存宽度

8

记忆密度

262144 bit

I/O类型

COMMON

内存IC类型

UVPROM

编程电压

12.5 V