Intel BD7500MB-SLH2F

包装/外壳

FCBGA-1295

表面安装

YES

终端数量

655

Moisture Sensitive

有

Integrated Graphics

无图形

FSB Parity

Parity

Factory Pack QuantityFactory Pack Quantity

600

Mounting Styles

SMD/SMT

Code Name

Boxboro

FSB Supported - Max

6.4 GT/s

Part # Aliases

906095

Manufacturer

Intel

Brand

Intel

PCIe Configurations

36 Lanes

Chipset Series

7500

Embedded Options

Non-Embedded

RoHS

Details

Package Description

FBGA, BGA655,23X29,32

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA655,23X29,32

Supply Voltage-Nom

1.1 V

Rohs Code

有

Manufacturer Part Number

BD7500MB/SLH2F

Package Code

FBGA

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.84

系列

7500

包装

Reel

类型

ICH

子类别

Chipsets

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B655

资历状况

不合格

电源

1.1 V

产品类别

Chipsets

产品

服务器芯片组

产品类别

Chipsets

宽度

37.5 mm

长度

37.5 mm