Intel BD7512/SLHBD

表面安装

YES

终端数量

655

Manufacturer Part Number

BD7512/SLHBD

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

FBGA, BGA655,23X29,32

Risk Rank

5.66

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA655,23X29,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom

0.95 V

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B655

资历状况

不合格

电源

0.95 V