Intel BX80539T2300E/SL9DM

表面安装

NO

终端数量

478

Manufacturer Part Number

BX80539T2300E/SL9DM

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Package Description

SPGA, PGA478,26X26,50

Risk Rank

5.84

Package Body Material

PLASTIC/EPOXY

Package Code

SPGA

Package Equivalence Code

PGA478,26X26,50

Package Shape

SQUARE

Package Style

GRID ARRAY, SHRINK PITCH

端子位置

PERPENDICULAR

终端形式

PIN/PEG

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PPGA-P478

资历状况

不合格

电源

1.1,1.5 V

速度

1660 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

电源电流-最大值

34000 mA

位元大小

64