Intel D8008

表面安装

NO

终端数量

18

Package Description

DIP, DIP18,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP18,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

D8008

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.86

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Microprocessors

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T18

资历状况

不合格

温度等级

COMMERCIAL

速度

0.5 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

8