Intel D8278

表面安装

NO

终端数量

40

Package Description

DIP, DIP40,.6

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP40,.6

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

D8278

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

并行 IO 端口

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T40

资历状况

不合格

温度等级

COMMERCIAL