Intel D85C960-20

表面安装

NO

终端数量

28

RoHS

Non-Compliant

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Supply Voltage-Nom

5 V

Reflow Temperature-Max (s)

未说明

Supply Voltage-Min

4.75 V

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

D85C960-20

Clock Frequency-Max

20 MHz

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Supply Voltage-Max

5.25 V

Risk Rank

5.85

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

技术

CHMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

JESD-30代码

R-CDIP-T28

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SYSTEM INTERFACE LOGIC, CONTROL AND COMMAND SIGNAL GENERATOR