Intel DH82H81SR177

表面安装

YES

终端数量

708

Manufacturer Part Number

DH82H81SR177

Part Life Cycle Code

生命周期结束

Ihs Manufacturer

INTEL CORP

Package Description

LFBGA,

Risk Rank

5.64

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

1.1 V

Supply Voltage-Min

0.998 V

Supply Voltage-Nom

1.05 V

RoHS

Compliant

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.65 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B708

uPs/uCs/外围ICs类型

MEMORY CONTROLLER, DRAM

座位高度-最大

1.29 mm

边界扫描

YES

低功率模式

YES

总线兼容性

USB; PCI; I2C; LPC; PS/2

库存数量

2

长度

23 mm

宽度

22 mm