Intel DT28F800F3B95

表面安装

YES

终端数量

56

RoHS

Non-Compliant

Package Description

SSOP,

Package Style

SMALL OUTLINE, SHRINK PITCH

Number of Words Code

512000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Access Time-Max

95 ns

Operating Temperature-Max

85 °C

Manufacturer Part Number

DT28F800F3B95

Number of Words

524288 words

Supply Voltage-Nom (Vsup)

3 V

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.79

Part Package Code

SSOP

附加功能

MIN 100,000 BLOCK ERASE CYCLES; BOTTOM BOOT BLOCK

端子位置

DUAL

终端形式

鸥翼

功能数量

1

端子间距

0.8 mm

Reach合规守则

unknown

引脚数量

56

JESD-30代码

R-PDSO-G56

资历状况

COMMERCIAL

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

SYNCHRONOUS

组织结构

512KX16

座位高度-最大

1.9 mm

内存宽度

16

记忆密度

8388608 bit

并行/串行

PARALLEL

内存IC类型

FLASH

编程电压

2.7 V

宽度

13.3 mm

长度

23.7 mm