Intel FLWB1501.C1SE000

表面安装

YES

终端数量

648

Manufacturer Part Number

FLWB1501.C1SE000

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Package Description

BGA, BGA648,33X33,40

Risk Rank

5.84

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA648,33X33,40

Package Shape

SQUARE

Package Style

网格排列

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B648

资历状况

不合格

电源

2.5,3.3 V