Intel FW82854

表面安装

YES

终端数量

732

Manufacturer Part Number

FW82854

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

BGA, BGA732,29X29,50

Risk Rank

5.69

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA732,29X29,50

Package Shape

SQUARE

Package Style

网格排列

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B732

资历状况

不合格

电源

1.5,2.5,3.3 V