Intel FWE6300ESB

表面安装

YES

终端数量

625

RoHS

Compliant

Package Description

BGA, BGA625,29X29,50

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA625,29X29,50

Rohs Code

无

Manufacturer Part Number

FWE6300ESB

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

8.76

子类别

Other uPs/uCs/Peripheral ICs

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B625

资历状况

不合格

电源

1.5,3.3,5 V