Intel FWMXP5800BC

表面安装

YES

终端数量

456

Manufacturer Part Number

FWMXP5800BC

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

BGA, BGA456,26X26,50

Risk Rank

5.71

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA456,26X26,50

Package Shape

SQUARE

Package Style

网格排列

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B456

资历状况

不合格

电源

1.25,3.3 V

温度等级

COMMERCIAL

消费者集成电路类型

消费电路