Intel GD82559ER S L3RB

表面安装

YES

终端数量

196

EU RoHS

不合规

ECCN (US)

5A991

HTS

8542.31.00.01

Automotive

无

PPAP

无

Category

单芯片

Physical Network Type

10BASE-T|100BASE-TX

Ethernet Speed (MBps)

10|100

Standard Supported

IEEE 802.3u|IEEE 802.3x

Communication Mode

Full Duplex|Half Duplex

Host Interface

PCI

Ethernet Interface Type

MII

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.5

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

DMA Support

有

Auto-Negotiation

有

Mounting

表面贴装

Package Height

1.21

Package Width

15

Package Length

15

PCB changed

196

Standard Package Name

BGA

Supplier Package

BGA

Lead Shape

Ball

Package Description

BGA,

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

GD82559ERSL3RB

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.9

Part Package Code

BGA

零件状态

Obsolete

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

1 mm

Reach合规守则

unknown

引脚数量

196

JESD-30代码

S-PBGA-B196

温度等级

OTHER

座位高度-最大

1.75 mm

通信IC类型

以太网收发器

宽度

15 mm

长度

15 mm