Intel GDPXA210B1C200

表面安装

YES

终端数量

225

Manufacturer Part Number

GDPXA210B1C200

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

FBGA, BGA225,15X15,32

Risk Rank

5.8

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA225,15X15,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B225

资历状况

不合格

电源

1,2.5/3.3,3.3 V

温度等级

COMMERCIAL

速度

200 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

32