Intel GE28F128K18C115

表面安装

YES

终端数量

56

Stranding element

无

Conductor category

Class 5 = flexible

Material outer sheath

Polyurethane (PUR)

Nominal voltage U

600

Min. permitted bending radius, stationary application/permanent installation

44

Min. permitted bending radius, moving application/free movement

81

Low smoke (according to EN 61034-2)

无

Screen over stranding

None

Nominal cross section conductor

2.5

Core identification

Numbers

Screen over stranding element

None

Outer diameter approx.

10.8

Permitted cable outer temperature during assembling/handling

-5 - 80

Colour outer sheath

Grey

Material core insulation

Polyvinyl chloride (PVC)

Permitted cable outer temperature after assembling without vibration

-40 - 80

Package Description

VFBGA, BGA56,7X8,30

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

8000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA56,7X8,30

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

未说明

Access Time-Max

115 ns

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

GE28F128K18C115

Number of Words

8388608 words

Supply Voltage-Nom (Vsup)

3 V

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.43

Part Package Code

BGA

JESD-609代码

e0

ECCN 代码

3A991.B.1.A

类型

NOR型号

端子表面处理

Tin/Lead (Sn/Pb)

附加功能

可进行同步突发模式操作

HTS代码

8542.32.00.51

子类别

闪存

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.75 mm

Reach合规守则

unknown

引脚数量

56

JESD-30代码

R-PBGA-B56

资历状况

不合格

电源电压-最大值(Vsup)

3.3 V

电源

1.8,3/3.3 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

ASYNCHRONOUS

电源电流-最大值

0.08 mA

组织结构

8MX16

座位高度-最大

1 mm

内存宽度

16

待机电流-最大值

0.000055 A

记忆密度

134217728 bit

并行/串行

PARALLEL

内存IC类型

FLASH

编程电压

3 V

数据轮询

NO

拨动位

NO

命令用户界面

YES

扇区/尺寸数

128

行业规模

64K

页面尺寸

8 words

通用闪存接口

YES

宽度

9 mm

长度

11 mm