Intel GE28F320B3TD70

表面安装

YES

终端数量

48

Stranding element

无

Permitted cable outer temperature after assembling without vibration

-40 - 80

Colour outer sheath

Black

Permitted cable outer temperature during assembling/handling

-30 - 80

Outer diameter approx.

37.4

Screen over stranding element

None

Core identification

None

Nominal cross section conductor

300

Screen over stranding

Braiding

Nominal voltage U0

600

Low smoke (according to EN 61034-2)

无

Min. permitted bending radius, moving application/free movement

187

Min. permitted bending radius, stationary application/permanent installation

113

Nominal voltage U

1000

Material outer sheath

Polyurethane (PUR)

Conductor category

Class 6 = very flexible

Package Description

VFBGA-48

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

2000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA48,6X8,30

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

30

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

GE28F320B3TD70

Number of Words

2097152 words

Supply Voltage-Nom (Vsup)

3 V

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Intel Corporation

Part Life Cycle Code

Transferred

Ihs Manufacturer

INTEL CORP

Risk Rank

5.33

Part Package Code

BGA

JESD-609代码

e0

ECCN 代码

3A991.B.1.A

类型

NOR型号

端子表面处理

锡铅

附加功能

TOP BOOT BLOCK

HTS代码

8542.32.00.51

子类别

闪存

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

240

功能数量

1

端子间距

0.75 mm

Reach合规守则

compliant

引脚数量

48

JESD-30代码

R-PBGA-B48

资历状况

不合格

电源电压-最大值(Vsup)

3.6 V

电源

1.8/3.3,3/3.3 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

ASYNCHRONOUS

电源电流-最大值

0.055 mA

组织结构

2MX16

座位高度-最大

1 mm

内存宽度

16

待机电流-最大值

0.000005 A

记忆密度

33554432 bit

并行/串行

PARALLEL

内存IC类型

FLASH

编程电压

2.7 V

数据轮询

NO

拨动位

NO

命令用户界面

YES

扇区/尺寸数

8,63

行业规模

4K,32K

引导模块

TOP

宽度

6.964 mm

长度

7.286 mm