Intel HH80553PG0964MN/SL9QQ

表面安装

YES

终端数量

775

Package Description

LGA, LGA775,30X33,46/43

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

LGA775,30X33,46/43

Supply Voltage-Nom

1.3 V

Rohs Code

有

Manufacturer Part Number

HH80553PG0964MN/SL9QQ

Package Code

LGA

Package Shape

RECTANGULAR

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

8.66

子类别

Microprocessors

技术

CMOS

端子位置

BOTTOM

终端形式

无铅

端子间距

1.1 mm

JESD-30代码

R-PBGA-N775

资历状况

不合格

电源

1.3 V

速度

3400 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

电源电流-最大值

125000 mA

位元大小

32

达到SVHC

unknown