Intel IM5610MJE

表面安装

NO

终端数量

16

Supply Voltage-Nom (Vsup)

5 V

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP16,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Number of Words Code

32

Number of Words

32 words

Access Time-Max

75 ns

Risk Rank

5.87

Package Description

DIP, DIP16,.3

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

Part Life Cycle Code

Transferred

Rohs Code

无

Manufacturer Part Number

IM5610MJE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5 V

温度等级

MILITARY

电源电流-最大值

0.1 mA

组织结构

32X8

内存宽度

8

内存IC类型

OTP ROM