Intel INTEL-2700G3

表面安装

YES

终端数量

364

Manufacturer Part Number

INTEL-2700G3

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

FBGA, BGA364,20X20,25

Risk Rank

5.74

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA364,20X20,25

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

端子位置

BOTTOM

终端形式

BALL

端子间距

0.635 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B364

资历状况

不合格

电源

1.2,1.8,2.5,3.3 V

位元大小

32