Intel INTEL-82PM965

表面安装

YES

终端数量

1299

Manufacturer Part Number

INTEL-82PM965

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

FBGA, BGA1299,51X51,32

Risk Rank

5.66

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA1299,51X51,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B1299

资历状况

不合格

电源

1.05,1.2,1.5,1.8,3.3 V