Intel KC82870DH

表面安装

YES

终端数量

567

Manufacturer Part Number

KC82870DH

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Package Description

BGA, BGA567,24X24,50

Risk Rank

5.84

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA567,24X24,50

Package Shape

SQUARE

Package Style

网格排列

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B567

资历状况

不合格

电源

1.8,2.5 V