Intel LD2004

表面安装

NO

终端数量

28

Package Description

DIP, DIP28,.6

Package Style

IN-LINE

Number of Words Code

512

Package Body Material

CERAMIC

Package Equivalence Code

DIP28,.6

Operating Temperature-Min

-40 °C

Access Time-Max

250 ns

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

LD2004

Number of Words

512 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

SRAMs

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T28

电源

5 V

温度等级

INDUSTRIAL

组织结构

512X8

内存宽度

8

记忆密度

4096 bit

内存IC类型

NON-VOLATILE SRAM

混合内存类型

N/A