Intel LD8254

表面安装

NO

终端数量

24

RoHS

Non-Compliant

Package Description

DIP, DIP24,.6

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.6

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

LD8254

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.9

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

模拟波形生成功能

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T24

电源

5 V

温度等级

INDUSTRIAL