Intel MD2114L3/B

表面安装

NO

终端数量

18

Manufacturer Part Number

MD2114L3/B

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

Package Description

DIP, DIP18,.3

Risk Rank

5.91

Access Time-Max

300 ns

Number of Words

1024 words

Number of Words Code

1000

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP18,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

RoHS

Non-Compliant

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T18

资历状况

不合格

电源

5 V

温度等级

MILITARY

操作模式

ASYNCHRONOUS

组织结构

1KX4

输出特性

3-STATE

内存宽度

4

记忆密度

4096 bit

筛选水平

38535Q/M;38534H;883B

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

标准SRAM