Intel MD3003/B

表面安装

NO

终端数量

28

Package

Box

厂商

KEMET

Product Status

活跃

Package Description

DIP, DIP28,.6

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP28,.6

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

MD3003/B

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.92

Usage Level

Military grade

系列

*

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

算术电路

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T28

资历状况

不合格

温度等级

MILITARY

逻辑IC类型

LOOK-AHEAD CARRY GENERATOR

筛选水平

38535Q/M;38534H;883B