Intel NH82580DB

表面安装

YES

终端数量

256

Package Description

HBGA,

Package Style

GRID ARRAY, HEAT SINK/SLUG

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-10 °C

Supply Voltage-Nom

1 V

Supply Voltage-Min

0.93 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

NH82580DB

Clock Frequency-Max

25 MHz

Package Code

HBGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Supply Voltage-Max

1.08 V

Risk Rank

5.72

附加功能

ALSO REQUIRES 1.8V SUPPLY

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

温度等级

OTHER

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, LAN

座位高度-最大

2.01 mm

边界扫描

YES

低功率模式

YES

串行I/O数

2

总线兼容性

I2C; PCI; SPI

最大数据传输率

640 MBps

通信协议

ASYNC, BIT

数据编码/解码方式

BIPH-LEVEL(MANCHESTER)

宽度

17 mm

长度

17 mm