Intel WG82574LSLBA9

表面安装

YES

终端数量

64

Supplier Package

QFN EP

Communication Mode

Full Duplex/Half Duplex

Category

单芯片

Loopback Mode

Internal

Standard Supported

IEEE 802.3/IEEE 802.3u

Host Interface

PCI

Auto-Negotiation

有

DMA Support

有

Mounting

表面贴装

Package Description

QFN-64

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

LCC64,.35SQ,20

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

3 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

WG82574LSLBA9

Clock Frequency-Max

25 MHz

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

生命周期结束

Ihs Manufacturer

INTEL CORP

Supply Voltage-Max

3.6 V

Risk Rank

5.73

Usage Level

Commercial grade

操作温度

0 to 85 °C

HTS代码

8542.31.00.01

子类别

Serial IO/Communication Controllers

技术

CMOS

端子位置

QUAD

终端形式

无铅

端子间距

0.5 mm

Reach合规守则

compliant

引脚数量

64

JESD-30代码

S-PQCC-N64

资历状况

不合格

工作电源电压

1.05, 1.9, 3.3 V

电源

1.9,3.3 V

温度等级

OTHER

速度

25 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER

有ADC

NO

DMA 通道

YES

数据率

10/100/1000 Mbps

脉宽调制通道

NO

数模转换器通道

NO

座位高度-最大

1 mm

筛选水平

Commercial

只读存储器可编程性

FLASH

宽度

9 mm

长度

9 mm