参数名
参数值
参数名
参数值
表面安装
NO
终端数量
16
ECCN (US)
EAR99
Demultiplexing Capability
1-of-8
Number of Elements per Chip
1
Number of Element Inputs
3
Number of Input Enables per Element
1
Number of Element Outputs
8
Number of Output Enables per Element
0
Maximum Propagation Delay Time @ Maximum CL (ns)
120@10V|225@5V
Absolute Propagation Delay Time (ns)
400
Process Technology
CMOS
Maximum Low Level Output Current (mA)
3.7(Min)
Maximum High Level Output Current (mA)
-3.7
Minimum Operating Supply Voltage (V)
4
Typical Operating Supply Voltage (V)
5
Maximum Operating Supply Voltage (V)
6.5
Maximum Quiescent Current (mA)
-0.5(Min)
Propagation Delay Test Condition (pF)
100
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
125
Standard Package Name
DIP
Supplier Package
SBCDIP
Mounting
通孔
Package Height
3.56(Max)
Package Length
21.34(Max)
Package Width
7.87(Max)
PCB changed
16
Lead Shape
通孔
Package Description
SIDE BRAZED, DIP-16
Package Style
IN-LINE
Load Capacitance (CL)
50 pF
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Equivalence Code
DIP16,.3
Operating Temperature-Min
-55 °C
Operating Temperature-Max
125 °C
Rohs Code
无
Manufacturer Part Number
CDP1853CD3
Supply Voltage-Nom (Vsup)
5 V
Package Code
DIP
Package Shape
RECTANGULAR
Manufacturer
Intersil Corporation
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTERSIL CORP
Risk Rank
5.3
Part Package Code
DIP
Prop.
400 ns
Usage Level
Military grade
JESD-609代码
e0
零件状态
Obsolete
ECCN 代码
EAR99
端子表面处理
Tin/Lead (Sn/Pb)
HTS代码
8542.39.00.01
子类别
Decoder/Drivers
技术
CMOS
端子位置
DUAL
终端形式
THROUGH-HOLE
功能数量
1
端子间距
2.54 mm
Reach合规守则
not_compliant
引脚数量
16
JESD-30代码
R-CDIP-T16
资历状况
不合格
极性
Non-Inverting
电源电压-最大值(Vsup)
6.5 V
电源
5 V
温度等级
MILITARY
电源电压-最小值(Vsup)
4 V
逻辑功能
Decoder/Demultiplexer
座位高度-最大
5.08 mm
输出极性
TRUE
逻辑IC类型
OTHER DECODER/DRIVER
最大 I(ol)
0.0016 A
筛选水平
38535Q/M;38534H;883B
传播延迟(tpd)
295 ns
输入调节
STANDARD
宽度
7.62 mm
RoHS状态
RoHS non-compliant