Intersil HI1-524-2

表面安装

NO

终端数量

18

Package Description

DIP, DIP18,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

On-state Resistance-Max (Ron)

1500 Ω

Package Equivalence Code

DIP18,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

HI1-524-2

Supply Voltage-Nom (Vsup)

15 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Intersil Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTERSIL CORP

Risk Rank

5.84

HTS代码

8542.39.00.01

子类别

多路复用器或开关

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T18

资历状况

不合格

电源

+-15 V

温度等级

MILITARY

通道数量

4

供应电流-最大值(Isup)

25 mA

负电源电压(Vsup)

-15 V

开关量

BREAK-BEFORE-MAKE

开启时间-最大值

300 ns