Intersil HM1-65162/883

表面安装

NO

终端数量

24

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

2000

Package Body Material

CERAMIC, GLASS-SEALED

Manufacturer Package Code

F24.624

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

NOT APPLICABLE

Access Time-Max

90 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

HM1-65162/883

Number of Words

2048 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

活跃

Samacsys Description

Memory 2kx8 Asynchronous CMOS Static RAM

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

5.23

Part Package Code

CERDIP

Usage Level

Military grade

JESD-609代码

e0

ECCN 代码

3A001.A.2.C

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.32.00.41

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

NOT APPLICABLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

compliant

引脚数量

24

JESD-30代码

R-GDIP-T24

资历状况

不合格

Brand Name

Renesas

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

2KX8

座位高度-最大

5.72 mm

内存宽度

8

记忆密度

16384 bit

筛选水平

MIL-STD-883

并行/串行

PARALLEL

内存IC类型

标准SRAM

宽度

15.24 mm