Intersil HM16518883

表面安装

NO

终端数量

18

Package

Bulk

厂商

PEI-Genesis

Product Status

活跃

Schedule B

8542320040

RoHS

Non-Compliant

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

1000

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Access Time-Max

250 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

HM1-6518/883

Number of Words

1024 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.8

系列

*

ECCN 代码

3A001.A.2.C

附加功能

ADDRESS LATCH; LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS

HTS代码

8542.32.00.41

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

unknown

JESD-30代码

R-GDIP-T18

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

1KX1

内存宽度

1

记忆密度

1024 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM