Intersil HM1-65642C/883

表面安装

NO

终端数量

28

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

8000

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Access Time-Max

200 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

HM1-65642C/883

Number of Words

8192 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.78

ECCN 代码

3A001.A.2.C

HTS代码

8542.32.00.41

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

unknown

JESD-30代码

R-GDIP-T28

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

8KX8

内存宽度

8

记忆密度

65536 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM