ISSI IS67WVE2M16DBLL-70BLA1

表面安装

YES

终端数量

48

Package Description

6 X 8 MM, LEAD FREE, MO-207, TFBGA-48

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Number of Words Code

2000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

IS67WVE2M16DBLL-70BLA1

Number of Words

2097152 words

Supply Voltage-Nom (Vsup)

3 V

Package Code

TFBGA

Package Shape

RECTANGULAR

Manufacturer

Integrated Silicon Solution Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED SILICON SOLUTION INC

Risk Rank

5.76

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.75 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B48

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

ASYNCHRONOUS

组织结构

2MX16

座位高度-最大

1.2 mm

内存宽度

16

记忆密度

33554432 bit

并行/串行

PARALLEL

内存IC类型

PSEUDO STATIC RAM

宽度

6 mm

长度

8 mm