Laird KA150-2AC-33X33
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KA150-2AC-33X33
1412-KA150-2AC-33X33
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THERMALLY CONDUCTIVE CHIP PAD, Thickness:0.16mm, Conductive Material:Aluminium Oxide Ceramic, Thermal Conductivity:-, Thermal Impedance:0.49°C/W, Volume Resistivity:-, External Length:300mm, External Width:300mm, Product Range:- RoHS Compliant: Ye
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