LSI LFLS7166-TS24

表面安装

YES

终端数量

24

Manufacturer Part Number

LFLS7166-TS24

Rohs Code

有

Part Life Cycle Code

接触制造商

Ihs Manufacturer

LSI COMPUTER SYSTEMS INC

Package Description

TSSOP, TSSOP24,.25

Risk Rank

5.6

Moisture Sensitivity Levels

1

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP24,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-G24

资历状况

不合格

电源

3.3/5 V

温度等级

OTHER

模拟 IC - 其他类型

模拟电路