MA-COM AM55-0024

表面安装

YES

终端数量

64

Package Description

FBGA, BGA64,8X8,32

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA64,8X8,32

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

AM55-0024

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

TE Connectivity

Part Life Cycle Code

Transferred

Ihs Manufacturer

TE CONNECTIVITY LTD

Risk Rank

5.74

子类别

接收器集成电路

端子位置

BOTTOM

终端形式

BALL

功能数量

2

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B64

资历状况

不合格

电源

3/5 V

温度等级

INDUSTRIAL