Microchip A3P1000-FGG144I

包装/外壳

FBGA-144

安装类型

表面贴装

表面安装

YES

供应商器件包装

144-FPBGA (13x13)

终端数量

144

Maximum Operating Supply Voltage

1.575 V

Minimum Operating Supply Voltage

1.425 V

Typical Operating Supply Voltage

1.5000 V

MSL

MSL 3 - 168 hours

Moisture Sensitive

有

Number of Logic Elements

11000 LE

Number of I/Os

97 I/O

Maximum Operating Temperature

+ 100 C

Supply Voltage-Max

1.575 V

Unit Weight

0.014110 oz

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

160

Supply Voltage-Min

1.425 V

Mounting Styles

SMD/SMT

Manufacturer

Microchip

Brand

Microchip Technology / Atmel

Maximum Operating Frequency

350 MHz

Tradename

ProASIC3

RoHS

Details

Package

Tray

Base Product Number

A3P1000

厂商

微芯片技术

Product Status

活跃

Package Description

LBGA,

Risk Rank

1.31

Ihs Manufacturer

MICROSEMI CORP

Part Life Cycle Code

活跃

Package Shape

SQUARE

Package Code

LBGA

Clock Frequency-Max

350 MHz

Manufacturer Part Number

A3P1000-FGG144I

Rohs Code

有

Operating Temperature-Max

100 °C

Reflow Temperature-Max (s)

40

Supply Voltage-Nom

1.5 V

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

Package Style

GRID ARRAY, LOW PROFILE

操作温度

-40 to 85 °C

系列

A3P1000

包装

Tray

JESD-609代码

e1

ECCN 代码

3A001.A.7.A

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

子类别

可编程逻辑集成电路

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

资历状况

不合格

工作电源电压

1.5 V

温度等级

INDUSTRIAL

数据率

-

组织结构

24576 CLBS, 1000000 GATES

座位高度-最大

1.55 mm

可编程逻辑类型

现场可编程门阵列

产品类别

FPGA - Field Programmable Gate Array

总 RAM 位数

144Kbit

阀门数量

1000000

速度等级

STD

收发器数量

-

逻辑块数量

24576

等效门数

1000000

产品类别

FPGA - Field Programmable Gate Array

长度

13 mm

宽度

13 mm