Microchip EX64-TQG100

表面安装

YES

终端数量

100

Family Name

eX

Operating Temperature (Max.)

70C

Operating Temperature Classification

COMMERCIALC

Package Type

TQFP

Device System Gates

3000

Operating Temp Range

0C to 70C

# I/Os (Max)

56

Number of Usable Gates

2000

Number of Logic Blocks/Elements

128

Process Technology

0.22UM

Operating Supply Voltage (Max)

2.7(V)

Operating Supply Voltage (Typ)

2.5(V)

Rad Hardened

无

Operating Supply Voltage (Min)

2.3(V)

Operating Temperature (Min.)

0C

Programmable

有

Logic Cells

128

# Registers

128

Mounting

表面贴装

Package Description

0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, TQFP-100

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP100,.63SQ,20

Supply Voltage-Nom

2.5 V

Reflow Temperature-Max (s)

40

Supply Voltage-Min

2.3 V

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

EX64-TQG100

Clock Frequency-Max

250 MHz

Package Code

LFQFP

Package Shape

SQUARE

Manufacturer

Actel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ACTEL CORP

Supply Voltage-Max

2.7 V

Risk Rank

5.83

包装

Tray

JESD-609代码

e3

端子表面处理

哑光锡

附加功能

ALSO REQUIRES 2.5V OR 3.3V OR 5V SUPPLY

子类别

现场可编程门阵列

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

频率

250(MHz)

引脚数量

100

JESD-30代码

S-PQFP-G100

输出的数量

56

资历状况

不合格

电源

2.5,2.5/5 V

温度等级

COMMERCIAL

输入数量

56

组织结构

128 CLBS, 3000 GATES

座位高度-最大

1.6 mm

可编程逻辑类型

现场可编程门阵列

CLB-Max的组合延时

1 ns

逻辑块数量

128

逻辑单元数

192

等效门数

3000

宽度

14 mm

长度

14 mm