Microchip HDMP-1687

表面安装

YES

终端数量

208

RoHS

Non-Compliant

Package Description

BGA, BGA208,17X17,50

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA208,17X17,50

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

HDMP-1687

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Broadcom Limited

Part Life Cycle Code

Obsolete

Ihs Manufacturer

BROADCOM LTD

Risk Rank

5.64

子类别

其他电信集成电路

技术

BIPOLAR

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B208

资历状况

不合格

电源

3.3 V

温度等级

OTHER