Microchip M2GL060T-FCSG325

安装类型

表面贴装

包装/外壳

325-TFBGA, FCBGA

表面安装

YES

供应商器件包装

325-FCBGA (11x11)

终端数量

325

Number of I/Os

200

Package

Tray

Base Product Number

M2GL060

厂商

微芯片技术

Product Status

活跃

Package Description

BGA,

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

1.14 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

M2GL060T-FCSG325

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.26 V

Risk Rank

5.26

Number of Logic Elements

56520 LE

Maximum Operating Temperature

+ 85 C

Minimum Operating Temperature

0 C

Mounting Styles

SMD/SMT

操作温度

0°C ~ 85°C (TJ)

系列

IGLOO2

HTS代码

8542.39.00.01

电压 - 供电

1.14V ~ 2.625V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

Reach合规守则

compliant

JESD-30代码

S-PBGA-B325

工作电源电压

1.2 V

温度等级

OTHER

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

56520

总 RAM 位数

1869824

收发器数量

2 Transceiver