Microchip MPF300TLS-FCVG484I

表面安装

YES

安装类型

表面贴装

包装/外壳

484-BBGA, FCBGA

供应商器件包装

484-FCBGA (19x19)

终端数量

484

Manufacturer Part Number

MPF300TLS-FCVG484I

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Package Description

FCBGA-484

Risk Rank

5.79

Operating Temperature-Max

100 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Max

1.03 V

Supply Voltage-Nom

1 V

Number of I/Os

284

Package

Tray

Base Product Number

MPF300

厂商

微芯片技术

Product Status

活跃

Number of Logic Elements

300000 LE

Maximum Operating Temperature

+ 100 C

Minimum Operating Temperature

- 40 C

Mounting Styles

SMD/SMT

Supply Voltage-Min

0.97 V

操作温度

-40°C ~ 100°C (TJ)

系列

PolarFire™

附加功能

CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL

电压 - 供电

0.97V ~ 1.08V

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B484

工作电源电压

1.05 V

温度等级

INDUSTRIAL

数据率

12.7 Gb/s

座位高度-最大

3.32 mm

可编程逻辑类型

现场可编程门阵列

逻辑元件/单元数

300000

总 RAM 位数

21094400

长度

19 mm

宽度

19 mm