Microchip MSDT200-16

表面安装

NO

终端数量

7

Vr - Reverse Voltage

1600 V

Maximum Operating Temperature

+ 150 C

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

10

Mounting Styles

螺钉安装

Manufacturer

Microchip

Brand

微芯片技术

RoHS

Details

Package Description

FLANGE MOUNT, R-XUFM-X7

Package Style

FLANGE MOUNT

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

MSDT200-16

Package Shape

RECTANGULAR

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.8

类型

3 Phase Bridge

附加功能

UL 认证

HTS代码

8541.30.00.80

子类别

Discrete Semiconductor Modules

技术

Si

端子位置

UPPER

终端形式

UNSPECIFIED

Reach合规守则

compliant

引脚数量

7

JESD-30代码

R-XUFM-X7

配置

SINGLE WITH BUILT-IN DIODE

箱体转运

ISOLATED

产品类别

Discrete Semiconductor Modules

触发装置类型

SCR

重复峰值关态电压

1600 V

重复峰值反向电压

1600 V

均方根通态电流-最大值

314 A

直流栅极触发电流（最大）

150 mA

产品

Rectifier Modules

产品类别

Discrete Semiconductor Modules