参数名
参数值
参数名
参数值
表面安装
YES
终端数量
20
Number of free ISA-slots
0
Supporting protocol for ASI
无
With floppy disc drive
无
Supporting protocol for Data-Highway
无
Supporting protocol for SERCOS
无
Number of HW-interfaces serial TTY
0
Number of HW-interfaces Wireless
0
Supporting protocol for INTERBUS-Safety
无
Radio standard Wi-Fi 802.11
无
Supporting protocol for DeviceNet
无
Supporting protocol for INTERBUS
无
Supporting protocol for LON
无
Number of free PCMCIA-slots
0
Supporting protocol for DeviceNet Safety
无
Supporting protocol for PROFINET CBA
无
Number of free AGP-slots
0
Supporting protocol for PROFIsafe
无
Suitable for safety functions
无
Supporting protocol for KNX
无
Supporting protocol for SafetyBUS p
无
Supporting protocol for CAN
无
Radio standard UMTS
无
Front built-in possible
无
Radio standard GSM
无
Supporting protocol for MODBUS
无
Supporting protocol for Foundation Fieldbus
无
Supporting protocol for SUCONET
无
Supporting protocol for AS-Interface Safety at Work
无
Radio standard Bluetooth
无
IO link master
无
Radio standard GPRS
无
Package Description
QFN-20
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Package Body Material
UNSPECIFIED
Operating Temperature-Min
-40 °C
Operating Temperature-Max
125 °C
Manufacturer Part Number
UCS1002-1-BP
Supply Voltage-Nom (Vsup)
5 V
Package Code
HVQCCN
Package Shape
SQUARE
Manufacturer
Microchip Technology Inc
Part Life Cycle Code
活跃
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
Risk Rank
5.57
端子位置
QUAD
终端形式
无铅
功能数量
1
端子间距
0.5 mm
Reach合规守则
compliant
JESD-30代码
S-XQCC-N20
电源电压-最大值(Vsup)
5.5 V
温度等级
AUTOMOTIVE
电源电压-最小值(Vsup)
4.5 V
模拟 IC - 其他类型
模拟电路
座位高度-最大
0.9 mm
宽度
4 mm
长度
4 mm