Microchip Technology 5962-0622906QYC

表面安装

YES

终端数量

68

ECCN (US)

4A994.a

Module

SRAM模块

Module Density

16Mbit

Number of Chip per Module

4

Chip Density (bit)

4M

Data Bus Width (bit)

4

Max. Access Time (ns)

18

Chip Configuration

512Kx8

Chip Package Type

68-MQFPT

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

170

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Supplier Temperature Grade

Military

ECC Support

无

SPD EEPROM Support

无

Supplier Package

MQFP-T

Mounting

表面贴装

Package Height

4.7(Max)

Package Length

64.14(Max)

Package Width

64.14(Max)

PCB changed

68

Package Description

GQFP, TPAK68,2.5SQ

Package Style

FLATPACK, GUARD RING

Number of Words Code

512000

Package Body Material

UNSPECIFIED

Package Equivalence Code

TPAK68,2.5SQ

Operating Temperature-Min

-55 °C

Access Time-Max

18 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

5962-0622906QYC

Number of Words

524288 words

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

GQFP

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.46

Usage Level

Military grade

零件状态

活跃

ECCN 代码

3A001.A.2.C

HTS代码

8542.32.00.41

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

68

JESD-30代码

S-XQFP-G68

资历状况

Qualified

电源电压-最大值(Vsup)

3.6 V

电源

3.3 V

温度等级

MILITARY

电源电压-最小值(Vsup)

3 V

操作模式

ASYNCHRONOUS

电源电流-最大值

0.17 mA

组织结构

4Mx4

输出特性

3-STATE

座位高度-最大

4.7 mm

内存宽度

32

待机电流-最大值

0.0045 A

记忆密度

16777216 bit

锁相环

无

筛选水平

MIL-PRF-38535 Class Q

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

标准SRAM

待机电压-最小值

2 V

自我刷新

无

宽度

24.14 mm

长度

24.14 mm

RoHS状态

供应商未确认