Microchip Technology A3P1000-2FG256

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

256-FPBGA (17x17)

终端数量

256

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Number of Logic Elements

11000 LE

Number of I/Os

177 I/O

Supply Voltage-Min

1.425 V

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 70 C

Mounting Styles

SMD/SMT

Maximum Operating Frequency

310 MHz

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

90

Tradename

ProASIC3

Unit Weight

0.014110 oz

Typical Operating Supply Voltage

1.5000 V

Minimum Operating Supply Voltage

1.425 V

Maximum Operating Supply Voltage

1.575 V

Supply Voltage-Max

1.575 V

Package

Tray

Base Product Number

A3P1000

厂商

微芯片技术

Product Status

活跃

Risk Rank

5.23

Ihs Manufacturer

MICROSEMI CORP

Part Life Cycle Code

活跃

Package Shape

SQUARE

Package Code

BGA

Clock Frequency-Max

350 MHz

Manufacturer Part Number

A3P1000-2FG256

Rohs Code

无

Operating Temperature-Max

85 °C

Reflow Temperature-Max (s)

30

Supply Voltage-Nom

1.5 V

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

Package Style

网格排列

Package Description

BGA,

系列

A3P1000

包装

Tray

操作温度

0 to 70 °C

端子表面处理

TIN LEAD/TIN LEAD SILVER

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

225

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

资历状况

不合格

工作电源电压

1.5 V

温度等级

COMMERCIAL

组织结构

24576 CLBS, 1000000 GATES

座位高度-最大

1.8 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

147456

阀门数量

1000000

速度等级

2

逻辑块数量

24576

等效门数

1000000

长度

17 mm

宽度

17 mm