Microchip Technology A3P1000-2FG484I

包装/外壳

FBGA

安装类型

表面贴装

表面安装

YES

供应商器件包装

484-FPBGA (23x23)

终端数量

484

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Number of Logic Elements

11000 LE

Number of I/Os

300 I/O

Supply Voltage-Min

1.425 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 85 C

Mounting Styles

SMD/SMT

Maximum Operating Frequency

310 MHz

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

60

Tradename

ProASIC3

Unit Weight

0.014110 oz

Supply Voltage-Max

1.575 V

Package

Tray

Base Product Number

A3P1000

厂商

微芯片技术

Product Status

活跃

Package Description

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

Package Style

网格排列

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

100 °C

Rohs Code

无

Manufacturer Part Number

A3P1000-2FG484I

Clock Frequency-Max

350 MHz

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.23

系列

A3P1000

包装

Tray

操作温度

-40°C ~ 100°C (TJ)

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

技术

CMOS

电压 - 供电

1.425V ~ 1.575V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

225

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B484

资历状况

不合格

工作电源电压

1.5 V

温度等级

INDUSTRIAL

组织结构

24576 CLBS, 1000000 GATES

座位高度-最大

2.44 mm

可编程逻辑类型

现场可编程门阵列

总 RAM 位数

147456

阀门数量

1000000

速度等级

2

逻辑块数量

24576

等效门数

1000000

宽度

23 mm

长度

23 mm