Microchip Technology A3P1000-FGG256M

包装/外壳

FBGA-256

安装类型

表面贴装

供应商器件包装

256-FBGA (17x17)

Shipping Restrictions

This product may require additional documentation to export from the United States.

Number of Logic Elements

11000 LE

Number of I/Os

177 I/O

Supply Voltage-Min

1.5 V

Minimum Operating Temperature

0 C

Maximum Operating Temperature

+ 85 C

Mounting Styles

SMD/SMT

Distributed RAM

144 kbit

Embedded Block RAM - EBR

144 kbit

Maximum Operating Frequency

350 MHz

Number of Logic Array Blocks - LABs

-

Factory Pack QuantityFactory Pack Quantity

90

Total Memory

1 kbit

Tradename

ProASIC3

Supply Voltage-Max

1.5 V

Package

Tray

Base Product Number

A3P1000

厂商

微芯片技术

Product Status

活跃

系列

A3P1000

包装

Tray

操作温度

-55°C ~ 125°C (TJ)

电压 - 供电

1.14V ~ 1.575V

工作电源电压

1.5 V

工作电源电流

8 mA

数据率

700 Mb/s

总 RAM 位数

147456

阀门数量

1000000